EDA Architect Skill

Define the architecture and constraints for electronics projects.

Auto-Activation Triggers

This skill activates when:

•User asks to "design a board", "create a project", "start a new PCB"
•User asks "what do I need for..." an electronics project
•Project has no docs/project-spec.md or docs/design-constraints.json
•User mentions requirements gathering or project planning

Context Requirements

Requires: Nothing (this is the first step)

Produces:

•docs/project-spec.md - Human-readable specification
•docs/design-constraints.json - Machine-readable constraints

Workflow

1. Understand the Project Goal

Ask the user about:

•What is this device/board intended to do?
•Target use case (prototype, production, hobby)?
•Any existing designs to reference?

2. Define Power Architecture

Determine:

•Input power source (USB, battery, mains, PoE, solar)
•Voltage rails needed (3.3V, 5V, 12V, etc.)
•
Power topology per rail: LDO vs buck converter
- •See reference/POWER-TOPOLOGY-DECISION.md for decision tree
•Estimated power budget
•Battery life requirements if applicable

2.5 Thermal Budget

Estimate early:

•Total power dissipation (sum of all consumers)
•Hot components (any >0.5W needs attention)
•Cooling strategy: natural, forced, heatsink
•See reference/THERMAL-BUDGET.md for estimation guide

3. Processing Requirements

Establish:

•MCU/processor needs (or if needed at all)
•Processing requirements (speed, peripherals)
•Memory requirements (Flash, RAM)
•Preferred families (STM32, ESP32, RP2040, etc.)

4. Connectivity & Interfaces

Document:

•Wireless: WiFi, Bluetooth, LoRa, Zigbee, cellular
•Wired: Ethernet, USB, CAN, RS485, RS232
•User interfaces: buttons, LEDs, displays
•Debug/programming interfaces

4.5 Stackup Decision

Determine layer count based on complexity:

•2-layer: Simple, LDO only, low-speed (I2C/SPI)
•4-layer: MCU with switching regulator, USB, Ethernet, WiFi
•6-layer: High-speed (>100MHz), DDR, dense routing
•See reference/LAYER-COUNT-DECISION.md for decision tree

5. Sensors & I/O

List:

•Required sensors
•Analog inputs/outputs
•Digital I/O requirements
•Any specialized interfaces (motor control, etc.)

6. Physical Constraints

Define:

•Target board dimensions
•Enclosure requirements
•Mounting hole positions
•Connector placement constraints
•Height restrictions

7. Environmental

Note:

•Operating temperature range
•Indoor/outdoor use
•IP rating if applicable

8. Manufacturing Targets

Capture:

•Target quantity
•Assembly method (hand, reflow, turnkey)
•Layer count preference
•Budget constraints

8.5 DFM Early Constraints

Capture manufacturer capabilities:

•Preferred manufacturer (JLCPCB, PCBWay, OSHPark)
•Assembly method constraints
•Fine-pitch components (affects hand soldering)
•Budget tier: prototype, low-volume, production

Output Format

project-spec.md Structure

markdown

# Project Specification: [Name]

## Overview
[Brief description and goals]

## Requirements Summary
| Category | Requirement |
|----------|-------------|
| Power Input | ... |
| Voltage Rails | ... |
| MCU | ... |
| Connectivity | ... |

## Detailed Requirements
[Sections for each category with full details]

## Constraints
[Physical, environmental, budget constraints]

## Open Questions
[Any unresolved items]

design-constraints.json Schema

See reference/CONSTRAINT-SCHEMA.md for full schema documentation.

Guidelines

•Ask clarifying questions rather than assuming
•Suggest common solutions when user is unsure
•Flag potential issues early (power budget, space constraints)
•Keep the spec focused - avoid scope creep
•Document rationale for key decisions
•Use project templates from reference/PROJECT-TEMPLATES.md as starting points

Architecture Validation Warnings

Before completing the architecture phase, check for these risky combinations:

Condition	Warning
2-layer + switching regulator	"Consider 4-layer - switching regulators need solid ground plane"
2-layer + USB/Ethernet	"Controlled impedance difficult on 2-layer - consider 4-layer"
>2W total + no thermal plan	"Add thermal budget - high power needs planning"
Hand assembly + fine-pitch (<0.5mm)	"Verify solderability - fine-pitch is difficult to hand solder"
>0.5W component + no thermal strategy	"Component dissipating >0.5W needs thermal attention"
Battery + LDO with high Vin-Vout	"Consider buck converter for battery life"

When a warning condition is detected, present it to the user and ask if they want to:

•Update the design to address it
•Acknowledge the risk and proceed

Next Steps

After completing architecture, suggest:

•/eda-source [component-role] to begin component selection
•Start with critical components: MCU, power regulators